Wafer-level packaging of three-dimensional MOEMS device with lens diaphragm

Joe F. Lo, Qiyin Fang, Laura Marcu, Eun Sok Kim

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper presents wafer level packaging of a miniature MOEMS monochromator for biomedical spectroscopy. Optical microlens and piezoelectrically-actuated diffraction grating are fabricated, and packaged at a wafer level into a complete, integrated monochromator with a fiber input. The packaged monochromator is an optical and mechanical system derived from a macroscale Czerny Turner monochromator. It integrates an angled mirror for folding and directing the input light path. A lithographically-defined reflective diffraction grating accepts and spectrally separates the input light from a fiber that is inserted into the built-in groove. The diffracted light is then collected through a diaphragm-suspended microlens and spatially separated on its path towards the output of the system. The packaging, done via encapsulated silicon cavities, provides batch processing and finishing of the complete device. The MLD is characterized with a Gaussian beam propagation model and the SSC packaged device is measured by its resolution and stray light through profiling with a CCD array.

Original languageEnglish (US)
Title of host publicationProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
Pages715-718
Number of pages4
StatePublished - 2007
Event20th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2007 - Kobe, Japan
Duration: Jan 21 2007Jan 25 2007

Other

Other20th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2007
CountryJapan
CityKobe
Period1/21/071/25/07

Fingerprint

MOEMS
microoptoelectromechanical systems
Monochromators
diaphragms
Diaphragms
monochromators
packaging
Lenses
Packaging
lenses
wafers
Diffraction gratings
gratings (spectra)
batch processing
Stray light
fibers
Gaussian beams
Fibers
Silicon
Charge coupled devices

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Mechanical Engineering
  • Condensed Matter Physics
  • Electronic, Optical and Magnetic Materials

Cite this

Lo, J. F., Fang, Q., Marcu, L., & Kim, E. S. (2007). Wafer-level packaging of three-dimensional MOEMS device with lens diaphragm. In Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS) (pp. 715-718). [4433086]

Wafer-level packaging of three-dimensional MOEMS device with lens diaphragm. / Lo, Joe F.; Fang, Qiyin; Marcu, Laura; Kim, Eun Sok.

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS). 2007. p. 715-718 4433086.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Lo, JF, Fang, Q, Marcu, L & Kim, ES 2007, Wafer-level packaging of three-dimensional MOEMS device with lens diaphragm. in Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)., 4433086, pp. 715-718, 20th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2007, Kobe, Japan, 1/21/07.
Lo JF, Fang Q, Marcu L, Kim ES. Wafer-level packaging of three-dimensional MOEMS device with lens diaphragm. In Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS). 2007. p. 715-718. 4433086
Lo, Joe F. ; Fang, Qiyin ; Marcu, Laura ; Kim, Eun Sok. / Wafer-level packaging of three-dimensional MOEMS device with lens diaphragm. Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS). 2007. pp. 715-718
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