Universal adhesive-free fit-to-flow microfluidic connections

Arnold Chen; Tingrui Pan

doi:10.1109/MEMSYS.2011.5734439

Universal adhesive-free fit-to-flow microfluidic connections

Arnold Chen, Tingrui Pan

Biomedical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

2 Scopus citations

Abstract

World-to-chip (macro-to-micro) interface continues to be one of the most complicated, ineffective, and unreliable components in the development of emerging μTAS involving integrated microfluidic operations. In this paper, we present standardized adhesive-free microfluidic interfaces, referred to as Fit-to-Flow (F2F) connections, using two physical mechanisms to achieve hermetic seal performance (up to 336 kPa), high-density 2D tube-packaging (1 tube/mm²), self-aligned plug-in (10.7 μm), and applicability to broad fluidic chip platforms. A 3D microfluidic mixer and a 6-level chemical gradient generator have been devised to illustrate the applicability of the universal fluidic connections to classic microfluidic operations.

Original language	English (US)
Title of host publication	2011 IEEE 24th International Conference on Micro Electro Mechanical Systems, MEMS 2011
Pages	372-375
Number of pages	4
DOIs	https://doi.org/10.1109/MEMSYS.2011.5734439
State	Published - Apr 13 2011
Event	24th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2011 - Cancun, Mexico Duration: Jan 23 2011 → Jan 27 2011

Other

Other	24th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2011
Country	Mexico
City	Cancun
Period	1/23/11 → 1/27/11

ASJC Scopus subject areas

Electrical and Electronic Engineering
Mechanical Engineering
Electronic, Optical and Magnetic Materials
Condensed Matter Physics

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10.1109/MEMSYS.2011.5734439

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Chen, A., & Pan, T. (2011). Universal adhesive-free fit-to-flow microfluidic connections. In 2011 IEEE 24th International Conference on Micro Electro Mechanical Systems, MEMS 2011 (pp. 372-375). [5734439] https://doi.org/10.1109/MEMSYS.2011.5734439

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