Abstract
World-to-chip (macro-to-micro) interface continues to be one of the most complicated, ineffective, and unreliable components in the development of emerging μTAS involving integrated microfluidic operations. In this paper, we present standardized adhesive-free microfluidic interfaces, referred to as Fit-to-Flow (F2F) connections, using two physical mechanisms to achieve hermetic seal performance (up to 336 kPa), high-density 2D tube-packaging (1 tube/mm2), self-aligned plug-in (10.7 μm), and applicability to broad fluidic chip platforms. A 3D microfluidic mixer and a 6-level chemical gradient generator have been devised to illustrate the applicability of the universal fluidic connections to classic microfluidic operations.
Original language | English (US) |
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Title of host publication | 2011 IEEE 24th International Conference on Micro Electro Mechanical Systems, MEMS 2011 |
Pages | 372-375 |
Number of pages | 4 |
DOIs | |
State | Published - Apr 13 2011 |
Event | 24th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2011 - Cancun, Mexico Duration: Jan 23 2011 → Jan 27 2011 |
Other
Other | 24th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2011 |
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Country/Territory | Mexico |
City | Cancun |
Period | 1/23/11 → 1/27/11 |
ASJC Scopus subject areas
- Electrical and Electronic Engineering
- Mechanical Engineering
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics