Universal adhesive-free fit-to-flow microfluidic connections

Arnold Chen, Tingrui Pan

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Scopus citations

Abstract

World-to-chip (macro-to-micro) interface continues to be one of the most complicated, ineffective, and unreliable components in the development of emerging μTAS involving integrated microfluidic operations. In this paper, we present standardized adhesive-free microfluidic interfaces, referred to as Fit-to-Flow (F2F) connections, using two physical mechanisms to achieve hermetic seal performance (up to 336 kPa), high-density 2D tube-packaging (1 tube/mm2), self-aligned plug-in (10.7 μm), and applicability to broad fluidic chip platforms. A 3D microfluidic mixer and a 6-level chemical gradient generator have been devised to illustrate the applicability of the universal fluidic connections to classic microfluidic operations.

Original languageEnglish (US)
Title of host publication2011 IEEE 24th International Conference on Micro Electro Mechanical Systems, MEMS 2011
Pages372-375
Number of pages4
DOIs
StatePublished - Apr 13 2011
Event24th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2011 - Cancun, Mexico
Duration: Jan 23 2011Jan 27 2011

Other

Other24th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2011
CountryMexico
CityCancun
Period1/23/111/27/11

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Mechanical Engineering
  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics

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  • Cite this

    Chen, A., & Pan, T. (2011). Universal adhesive-free fit-to-flow microfluidic connections. In 2011 IEEE 24th International Conference on Micro Electro Mechanical Systems, MEMS 2011 (pp. 372-375). [5734439] https://doi.org/10.1109/MEMSYS.2011.5734439