Relationships between morphology and stress-state of gold-silver alloys and nanoporous gold blanket films

Erkin Seker; J. T. Gaskins; M. R. Begley; H. Bart-Smith; G. Zangari; R. G. Kelly; M. L. Reed

doi:10.1149/1.2909724

Relationships between morphology and stress-state of gold-silver alloys and nanoporous gold blanket films

Erkin Seker, J. T. Gaskins, M. R. Begley, H. Bart-Smith, G. Zangari, R. G. Kelly, M. L. Reed

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

2 Scopus citations

Abstract

Gold-silver alloy films deposited on silicon wafers were annealed at temperatures between 100°C and 400°C, and subsequently dealloyed. The grain morphology and stress-state evolution of the samples before and after dealloying were studied by scanning electron microscopy and wafer curvature measurements. The residual stress in alloy films was augmented through thermal treatment; however, the subsequent dealloying step mitigated the residual stress without introducing significant changes in pore morphology. Possible mechanisms for stress and morphology evolution are reported.

Original language	English (US)
Title of host publication	ECS Transactions - Stress Related Phenomena in Electrochemical Systems
Pages	43-48
Number of pages	6
Volume	11
Edition	24
DOIs	https://doi.org/10.1149/1.2909724
State	Published - Dec 24 2008
Externally published	Yes
Event	Stress Related Phenomena in Electrochemical Systems - 212th ECS Meeting - Washington, DC, United States Duration: Oct 7 2007 → Oct 12 2007

Other

Other	Stress Related Phenomena in Electrochemical Systems - 212th ECS Meeting
Country/Territory	United States
City	Washington, DC
Period	10/7/07 → 10/12/07

ASJC Scopus subject areas

Engineering(all)

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10.1149/1.2909724

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Relationships between morphology and stress-state of gold-silver alloys and nanoporous gold blanket films. / Seker, Erkin; Gaskins, J. T.; Begley, M. R.; Bart-Smith, H.; Zangari, G.; Kelly, R. G.; Reed, M. L.

ECS Transactions - Stress Related Phenomena in Electrochemical Systems. Vol. 11 24. ed. 2008. p. 43-48.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Seker, E, Gaskins, JT, Begley, MR, Bart-Smith, H, Zangari, G, Kelly, RG & Reed, ML 2008, Relationships between morphology and stress-state of gold-silver alloys and nanoporous gold blanket films. in ECS Transactions - Stress Related Phenomena in Electrochemical Systems. 24 edn, vol. 11, pp. 43-48, Stress Related Phenomena in Electrochemical Systems - 212th ECS Meeting, Washington, DC, United States, 10/7/07. https://doi.org/10.1149/1.2909724

@inproceedings{38afaedf95bc4e7ab57fe5c665e6f680,

title = "Relationships between morphology and stress-state of gold-silver alloys and nanoporous gold blanket films",

abstract = "Gold-silver alloy films deposited on silicon wafers were annealed at temperatures between 100°C and 400°C, and subsequently dealloyed. The grain morphology and stress-state evolution of the samples before and after dealloying were studied by scanning electron microscopy and wafer curvature measurements. The residual stress in alloy films was augmented through thermal treatment; however, the subsequent dealloying step mitigated the residual stress without introducing significant changes in pore morphology. Possible mechanisms for stress and morphology evolution are reported.",

author = "Erkin Seker and Gaskins, {J. T.} and Begley, {M. R.} and H. Bart-Smith and G. Zangari and Kelly, {R. G.} and Reed, {M. L.}",

year = "2008",

month = dec,

day = "24",

doi = "10.1149/1.2909724",

language = "English (US)",

isbn = "9781605601960",

volume = "11",

pages = "43--48",

booktitle = "ECS Transactions - Stress Related Phenomena in Electrochemical Systems",

edition = "24",

note = "Stress Related Phenomena in Electrochemical Systems - 212th ECS Meeting ; Conference date: 07-10-2007 Through 12-10-2007",

}

TY - GEN

T1 - Relationships between morphology and stress-state of gold-silver alloys and nanoporous gold blanket films

AU - Seker, Erkin

AU - Gaskins, J. T.

AU - Begley, M. R.

AU - Bart-Smith, H.

AU - Zangari, G.

AU - Kelly, R. G.

AU - Reed, M. L.

PY - 2008/12/24

Y1 - 2008/12/24

N2 - Gold-silver alloy films deposited on silicon wafers were annealed at temperatures between 100°C and 400°C, and subsequently dealloyed. The grain morphology and stress-state evolution of the samples before and after dealloying were studied by scanning electron microscopy and wafer curvature measurements. The residual stress in alloy films was augmented through thermal treatment; however, the subsequent dealloying step mitigated the residual stress without introducing significant changes in pore morphology. Possible mechanisms for stress and morphology evolution are reported.

AB - Gold-silver alloy films deposited on silicon wafers were annealed at temperatures between 100°C and 400°C, and subsequently dealloyed. The grain morphology and stress-state evolution of the samples before and after dealloying were studied by scanning electron microscopy and wafer curvature measurements. The residual stress in alloy films was augmented through thermal treatment; however, the subsequent dealloying step mitigated the residual stress without introducing significant changes in pore morphology. Possible mechanisms for stress and morphology evolution are reported.

UR - http://www.scopus.com/inward/record.url?scp=57749199479&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=57749199479&partnerID=8YFLogxK

U2 - 10.1149/1.2909724

DO - 10.1149/1.2909724

M3 - Conference contribution

AN - SCOPUS:57749199479

SN - 9781605601960

VL - 11

SP - 43

EP - 48

BT - ECS Transactions - Stress Related Phenomena in Electrochemical Systems

T2 - Stress Related Phenomena in Electrochemical Systems - 212th ECS Meeting

Y2 - 7 October 2007 through 12 October 2007

ER -

Relationships between morphology and stress-state of gold-silver alloys and nanoporous gold blanket films

Abstract

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