Relationships between morphology and stress-state of gold-silver alloys and nanoporous gold blanket films

Erkin Seker, J. T. Gaskins, M. R. Begley, H. Bart-Smith, G. Zangari, R. G. Kelly, M. L. Reed

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Abstract

Gold-silver alloy films deposited on silicon wafers were annealed at temperatures between 100°C and 400°C, and subsequently dealloyed. The grain morphology and stress-state evolution of the samples before and after dealloying were studied by scanning electron microscopy and wafer curvature measurements. The residual stress in alloy films was augmented through thermal treatment; however, the subsequent dealloying step mitigated the residual stress without introducing significant changes in pore morphology. Possible mechanisms for stress and morphology evolution are reported.

Original languageEnglish (US)
Title of host publicationECS Transactions - Stress Related Phenomena in Electrochemical Systems
Pages43-48
Number of pages6
Volume11
Edition24
DOIs
StatePublished - Dec 24 2008
Externally publishedYes
EventStress Related Phenomena in Electrochemical Systems - 212th ECS Meeting - Washington, DC, United States
Duration: Oct 7 2007Oct 12 2007

Other

OtherStress Related Phenomena in Electrochemical Systems - 212th ECS Meeting
CountryUnited States
CityWashington, DC
Period10/7/0710/12/07

ASJC Scopus subject areas

  • Engineering(all)

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    Seker, E., Gaskins, J. T., Begley, M. R., Bart-Smith, H., Zangari, G., Kelly, R. G., & Reed, M. L. (2008). Relationships between morphology and stress-state of gold-silver alloys and nanoporous gold blanket films. In ECS Transactions - Stress Related Phenomena in Electrochemical Systems (24 ed., Vol. 11, pp. 43-48) https://doi.org/10.1149/1.2909724