Print-to-pattern dry film photoresist lithography

Shaun P. Garland, Terrence M. Murphy, Tingrui Pan

Research output: Contribution to journalArticle

8 Scopus citations

Abstract

Here we present facile microfabrication processes, referred to as print-to-pattern dry film photoresist (DFP) lithography, that utilize the combined advantages of wax printing and DFP to produce micropatterned substrates with high resolution over a large surface area in a non-cleanroom setting. The print-to-pattern methods can be performed in an out-of-cleanroom environment making microfabrication much more accessible to minimally equipped laboratories. Two different approaches employing either wax photomasks or wax etchmasks from a solid ink desktop printer have been demonstrated that allow the DFP to be processed in a negative tone or positive tone fashion, respectively, with resolutions of 100 m. The effect of wax melting on resolution and as a bonding material was also characterized. In addition, solid ink printers have the capacity to pattern large areas with high resolution, which was demonstrated by stacking DFP layers in a 50 mm × 50 mm woven pattern with 1 mm features. By using an office printer to generate the masking patterns, the mask designs can be easily altered in a graphic user interface to enable rapid prototyping.

Original languageEnglish (US)
Article number057002
JournalJournal of Micromechanics and Microengineering
Volume24
Issue number5
DOIs
StatePublished - Jan 1 2014

Keywords

  • DIY
  • dry film photoresist
  • lithography
  • rapid prototyping
  • solid ink printing

ASJC Scopus subject areas

  • Mechanics of Materials
  • Electronic, Optical and Magnetic Materials
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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