Mitigation of tensile failure in released nanoporous metal microstructures via thermal treatment

Jianzhong Zhu; Erkin Seker; Hilary Bart-Smith; Matthew R. Begley; Robert G. Kelly; Giovanni Zangari; Whye Kei Lye; Michael L. Reed

doi:10.1063/1.2357586

Mitigation of tensile failure in released nanoporous metal microstructures via thermal treatment

Jianzhong Zhu, Erkin Seker, Hilary Bart-Smith, Matthew R. Begley, Robert G. Kelly, Giovanni Zangari, Whye Kei Lye, Michael L. Reed

Research output: Contribution to journal › Article

30 Scopus citations

Abstract

The authors have developed a method to fabricate released microstructures of nanoporous Au (np-Au) by dealloying a Au-Ag alloy film patterned over a sacrificial Al layer. Doubly clamped bridges fail during dealloying owing to large tensile stresses induced during the dealloying process. Thermal treatments of released microstructures prior to dealloying generate sufficient compressive stress to induce plastic buckling. This buckling compensates the tensile stresses generated during the dealloying process, thus mitigating fracture of the np-Au.

Original language	English (US)
Article number	133104
Journal	Applied Physics Letters
Volume	89
Issue number	13
DOIs	https://doi.org/10.1063/1.2357586
State	Published - Oct 6 2006
Externally published	Yes

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ASJC Scopus subject areas

Physics and Astronomy (miscellaneous)

Cite this

Zhu, J., Seker, E., Bart-Smith, H., Begley, M. R., Kelly, R. G., Zangari, G., Lye, W. K., & Reed, M. L. (2006). Mitigation of tensile failure in released nanoporous metal microstructures via thermal treatment. Applied Physics Letters, 89(13), [133104]. https://doi.org/10.1063/1.2357586

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10.1063/1.2357586