Microwave enhanced silica encapsulation of magnetic nanoparticles

Jeong Chan Park, Dustin A. Gilbert, Kai Liu, Angelique Y. Louie

Research output: Contribution to journalArticle

14 Citations (Scopus)

Abstract

The surface modification of various nanoparticles with silica has been exploited to increase their utility for bioapplications. However, silica encapsulation through conventional methods requires long reaction times (hours to days). Herein, we demonstrated that uniform and spherical silica encapsulation of magnetic nanoparticles can be achieved within 10 min via microwave irradiation after phase transferring monodisperse magnetic nanoparticles from organic to water phase. In addition, we showed that silica shell addition through microwave synthesis is more effective than conventional heating methods, such as a hot plate. The approach that we propose may be useful in preparing multifunctional nano-probes, particularly for radiolabeling, which requires fast preparation times.

Original languageEnglish (US)
Pages (from-to)8449-8454
Number of pages6
JournalJournal of Materials Chemistry
Volume22
Issue number17
DOIs
StatePublished - May 7 2012

Fingerprint

Encapsulation
Silicon Dioxide
Silica
Microwaves
Nanoparticles
Microwave irradiation
Surface treatment
Heating
Water

ASJC Scopus subject areas

  • Materials Chemistry
  • Chemistry(all)

Cite this

Microwave enhanced silica encapsulation of magnetic nanoparticles. / Park, Jeong Chan; Gilbert, Dustin A.; Liu, Kai; Louie, Angelique Y.

In: Journal of Materials Chemistry, Vol. 22, No. 17, 07.05.2012, p. 8449-8454.

Research output: Contribution to journalArticle

Park, JC, Gilbert, DA, Liu, K & Louie, AY 2012, 'Microwave enhanced silica encapsulation of magnetic nanoparticles', Journal of Materials Chemistry, vol. 22, no. 17, pp. 8449-8454. https://doi.org/10.1039/c2jm16595c
Park, Jeong Chan ; Gilbert, Dustin A. ; Liu, Kai ; Louie, Angelique Y. / Microwave enhanced silica encapsulation of magnetic nanoparticles. In: Journal of Materials Chemistry. 2012 ; Vol. 22, No. 17. pp. 8449-8454.
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