Abstract
In this paper, we present microfabrication of a novel photopatternable conductive PDMS material with silver powder as conductive filler and benzophenone as photosensitive component, employing standard photolithography approach. An array of miniaturized capacitive pressure sensors is micromachined onto flexible polymeric transparency using this approach. Highest conductivity of -10 4 S.m -1 and minimal feature resolution of 60 μm have been successfully achieved. In addition, a thermal compression step can mold the microfabricated device into a desired shape (e.g., contact lens). The unique combination of physical properties from both silver filler and PDMS matrix along with photopatternability makes the conductive PDMS composite an excellent material for biological and clinical sensing applications.
| Original language | English (US) |
|---|---|
| Title of host publication | 4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2009 |
| Pages | 731-734 |
| Number of pages | 4 |
| DOIs | |
| State | Published - Oct 12 2009 |
| Event | 4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2009 - Shenzhen, China Duration: Jan 5 2009 → Jan 8 2009 |
Other
| Other | 4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2009 |
|---|---|
| Country | China |
| City | Shenzhen |
| Period | 1/5/09 → 1/8/09 |
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Keywords
- Conductive photoresist
- Microfabrication
- Photolithography
- Polydimethylsiloxane (PDMS)
- Silver powder
ASJC Scopus subject areas
- Electrical and Electronic Engineering
Cite this
Microfabrication of conductive PDMS on flexible substrates for biomedical applications. / Cong, Hailin; Pan, Tingrui.
4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2009. 2009. p. 731-734 5068682.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
}
TY - GEN
T1 - Microfabrication of conductive PDMS on flexible substrates for biomedical applications
AU - Cong, Hailin
AU - Pan, Tingrui
PY - 2009/10/12
Y1 - 2009/10/12
N2 - In this paper, we present microfabrication of a novel photopatternable conductive PDMS material with silver powder as conductive filler and benzophenone as photosensitive component, employing standard photolithography approach. An array of miniaturized capacitive pressure sensors is micromachined onto flexible polymeric transparency using this approach. Highest conductivity of -10 4 S.m -1 and minimal feature resolution of 60 μm have been successfully achieved. In addition, a thermal compression step can mold the microfabricated device into a desired shape (e.g., contact lens). The unique combination of physical properties from both silver filler and PDMS matrix along with photopatternability makes the conductive PDMS composite an excellent material for biological and clinical sensing applications.
AB - In this paper, we present microfabrication of a novel photopatternable conductive PDMS material with silver powder as conductive filler and benzophenone as photosensitive component, employing standard photolithography approach. An array of miniaturized capacitive pressure sensors is micromachined onto flexible polymeric transparency using this approach. Highest conductivity of -10 4 S.m -1 and minimal feature resolution of 60 μm have been successfully achieved. In addition, a thermal compression step can mold the microfabricated device into a desired shape (e.g., contact lens). The unique combination of physical properties from both silver filler and PDMS matrix along with photopatternability makes the conductive PDMS composite an excellent material for biological and clinical sensing applications.
KW - Conductive photoresist
KW - Microfabrication
KW - Photolithography
KW - Polydimethylsiloxane (PDMS)
KW - Silver powder
UR - http://www.scopus.com/inward/record.url?scp=70349690774&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=70349690774&partnerID=8YFLogxK
U2 - 10.1109/NEMS.2009.5068682
DO - 10.1109/NEMS.2009.5068682
M3 - Conference contribution
AN - SCOPUS:70349690774
SN - 9781424446308
SP - 731
EP - 734
BT - 4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2009
ER -