Investigating porosity and stress evolution in nanoporous gold films by timed thermal treatment

Erkin Seker, M. Begley, H. Bart-Smith, G. Zangari, R. Kelly, M. L. Reed

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Abstract

The stress evolution in nanoporous gold (np-Au) films and the influence of annealing temperature and duration was studied. Pore morphology was controlled by simply annealing the np-Au films. To study the relationship between porosity and stress evolution, np-Au films were fabricated on silicon wafers and the porosity was varied by thermal annealing at temperatures 200, 300, and 400°C with durations of 2.5, 10, and 20 minutes. Analysis of porosity (via digital image processing of scanning electron microscope images) revealed that the average pore radii of samples increased non-monotonically with the annealing temperature and reached a steady-state value with time. Wafer curvature tests showed that the tensile residual stress in films increased with temperature, and leveled off with time (except for 400°C, where it increased). While thicknesses of the np-Au films remained relatively unchanged for 200 and 300°C cases, it decreased for 400°C.

Original languageEnglish (US)
Title of host publicationECS Trancsactions - Nanoporous Materials
Subtitle of host publicationChemistry and Applications
Pages91-97
Number of pages7
Volume6
Edition11
DOIs
StatePublished - Dec 1 2007
Externally publishedYes
EventNanoporous Materials: Chemistry and Applications - 211th ECS Meeting - Chicago, IL, United States
Duration: May 6 2007May 11 2007

Other

OtherNanoporous Materials: Chemistry and Applications - 211th ECS Meeting
CountryUnited States
CityChicago, IL
Period5/6/075/11/07

ASJC Scopus subject areas

  • Engineering(all)

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    Seker, E., Begley, M., Bart-Smith, H., Zangari, G., Kelly, R., & Reed, M. L. (2007). Investigating porosity and stress evolution in nanoporous gold films by timed thermal treatment. In ECS Trancsactions - Nanoporous Materials: Chemistry and Applications (11 ed., Vol. 6, pp. 91-97) https://doi.org/10.1149/1.2790418