Effect of Dissolution Kinetics on Feature Size in Dip-Pen Nanolithography

B. L. Weeks, Aleksandr Noy, A. E. Miller, J. J. De Yoreo

Research output: Contribution to journalArticle

2 Citations (Scopus)

Abstract

We have investigated the effects of humidity, tip speed, and dwell time on feature size during dip pen nanolithography. Our results indicate a transition between two distinct deposition regimes occurs at a dwell time independent of humidity. While feature size increases with humidity, the relative increase is independent of dwell time. The results are described by a model that accounts for detachment and reattachment at the tip. The model suggests that, at short dwell times (high speed), the most important parameter controlling the feature size is the activation energy for thiol detachment.

Original languageEnglish (US)
Number of pages1
JournalPhysical Review Letters
Volume88
Issue number25
DOIs
StatePublished - Jan 1 2002
Externally publishedYes

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pens
dwell
dissolving
humidity
kinetics
detachment
tip speed
thiols
attachment
high speed
activation energy

ASJC Scopus subject areas

  • Physics and Astronomy(all)

Cite this

Effect of Dissolution Kinetics on Feature Size in Dip-Pen Nanolithography. / Weeks, B. L.; Noy, Aleksandr; Miller, A. E.; De Yoreo, J. J.

In: Physical Review Letters, Vol. 88, No. 25, 01.01.2002.

Research output: Contribution to journalArticle

Weeks, B. L. ; Noy, Aleksandr ; Miller, A. E. ; De Yoreo, J. J. / Effect of Dissolution Kinetics on Feature Size in Dip-Pen Nanolithography. In: Physical Review Letters. 2002 ; Vol. 88, No. 25.
@article{92967c51869b4b608ade558302af2df6,
title = "Effect of Dissolution Kinetics on Feature Size in Dip-Pen Nanolithography",
abstract = "We have investigated the effects of humidity, tip speed, and dwell time on feature size during dip pen nanolithography. Our results indicate a transition between two distinct deposition regimes occurs at a dwell time independent of humidity. While feature size increases with humidity, the relative increase is independent of dwell time. The results are described by a model that accounts for detachment and reattachment at the tip. The model suggests that, at short dwell times (high speed), the most important parameter controlling the feature size is the activation energy for thiol detachment.",
author = "Weeks, {B. L.} and Aleksandr Noy and Miller, {A. E.} and {De Yoreo}, {J. J.}",
year = "2002",
month = "1",
day = "1",
doi = "10.1103/PhysRevLett.88.255505",
language = "English (US)",
volume = "88",
journal = "Physical Review Letters",
issn = "0031-9007",
publisher = "American Physical Society",
number = "25",

}

TY - JOUR

T1 - Effect of Dissolution Kinetics on Feature Size in Dip-Pen Nanolithography

AU - Weeks, B. L.

AU - Noy, Aleksandr

AU - Miller, A. E.

AU - De Yoreo, J. J.

PY - 2002/1/1

Y1 - 2002/1/1

N2 - We have investigated the effects of humidity, tip speed, and dwell time on feature size during dip pen nanolithography. Our results indicate a transition between two distinct deposition regimes occurs at a dwell time independent of humidity. While feature size increases with humidity, the relative increase is independent of dwell time. The results are described by a model that accounts for detachment and reattachment at the tip. The model suggests that, at short dwell times (high speed), the most important parameter controlling the feature size is the activation energy for thiol detachment.

AB - We have investigated the effects of humidity, tip speed, and dwell time on feature size during dip pen nanolithography. Our results indicate a transition between two distinct deposition regimes occurs at a dwell time independent of humidity. While feature size increases with humidity, the relative increase is independent of dwell time. The results are described by a model that accounts for detachment and reattachment at the tip. The model suggests that, at short dwell times (high speed), the most important parameter controlling the feature size is the activation energy for thiol detachment.

UR - http://www.scopus.com/inward/record.url?scp=85038330143&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85038330143&partnerID=8YFLogxK

U2 - 10.1103/PhysRevLett.88.255505

DO - 10.1103/PhysRevLett.88.255505

M3 - Article

AN - SCOPUS:85038330143

VL - 88

JO - Physical Review Letters

JF - Physical Review Letters

SN - 0031-9007

IS - 25

ER -