Effect of dissolution kinetics on feature size in dip-pen nanolithography

B. L. Weeks, Aleksandr Noy, A. E. Miller, J. J. De Yoreo

Research output: Contribution to journalArticle

123 Citations (Scopus)

Abstract

The effect of dissolution kinetics on feature size in dip-pen nanolithography was studied. The results indicated that the transition between the two distinct deposition regimes occurred at a dwell time independent of humidity. The results were described by a model which suggested that at short dwell times, the most important parameter controlling the feature size is the activation energy for thiol detachment. The model predicted dependencies of feature size on dwell time and tip speed.

Original languageEnglish (US)
Pages (from-to)2555051-2555054
Number of pages4
JournalPhysical Review Letters
Volume88
Issue number25 I
StatePublished - Jun 24 2002
Externally publishedYes

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pens
dwell
dissolving
kinetics
tip speed
detachment
thiols
humidity
activation energy

ASJC Scopus subject areas

  • Physics and Astronomy(all)

Cite this

Weeks, B. L., Noy, A., Miller, A. E., & De Yoreo, J. J. (2002). Effect of dissolution kinetics on feature size in dip-pen nanolithography. Physical Review Letters, 88(25 I), 2555051-2555054.

Effect of dissolution kinetics on feature size in dip-pen nanolithography. / Weeks, B. L.; Noy, Aleksandr; Miller, A. E.; De Yoreo, J. J.

In: Physical Review Letters, Vol. 88, No. 25 I, 24.06.2002, p. 2555051-2555054.

Research output: Contribution to journalArticle

Weeks, BL, Noy, A, Miller, AE & De Yoreo, JJ 2002, 'Effect of dissolution kinetics on feature size in dip-pen nanolithography', Physical Review Letters, vol. 88, no. 25 I, pp. 2555051-2555054.
Weeks BL, Noy A, Miller AE, De Yoreo JJ. Effect of dissolution kinetics on feature size in dip-pen nanolithography. Physical Review Letters. 2002 Jun 24;88(25 I):2555051-2555054.
Weeks, B. L. ; Noy, Aleksandr ; Miller, A. E. ; De Yoreo, J. J. / Effect of dissolution kinetics on feature size in dip-pen nanolithography. In: Physical Review Letters. 2002 ; Vol. 88, No. 25 I. pp. 2555051-2555054.
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