Developments in limited data image reconstruction techniques for ultrahigh-resolution x-ray tomographic imaging of microchips

Waleed S. Haddad, James E. Trebes

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Scopus citations

Abstract

The use of soft x-ray nanotomography techniques for the evaluation and failure mode analysis of microchips was investigated. Realistic numerical simulations of the imaging process were performed and a specialized approach to image reconstruction from limited projection data was devised. Prior knowledge of the structure and its component materials was used to eliminate artifacts in the reconstructed images so that defects and deviations from the original design could be visualized. Simulated data sets wee generated with a total of 21 projections over three different angular ranges: -50 to +50, -80 to +80 and -90 to +90 degrees. In addition, a low level of illumination was assumed. It was shown that sub-micron defects within one cell of a microchip could be imaged in 3D using such an approach.

Original languageEnglish (US)
Title of host publicationProceedings of SPIE - The International Society for Optical Engineering
Pages222-231
Number of pages10
Volume3149
DOIs
StatePublished - 1997
Externally publishedYes
EventDevelopments in X-Ray Tomography - San Diego, CA, United States
Duration: Jul 28 1997Jul 28 1997

Other

OtherDevelopments in X-Ray Tomography
CountryUnited States
CitySan Diego, CA
Period7/28/977/28/97

Keywords

  • 3-D imaging
  • Image reconstruction
  • Iterative optimization
  • Microchips
  • X-ray tomography
  • Zone plates

ASJC Scopus subject areas

  • Applied Mathematics
  • Computer Science Applications
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics

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    Haddad, W. S., & Trebes, J. E. (1997). Developments in limited data image reconstruction techniques for ultrahigh-resolution x-ray tomographic imaging of microchips. In Proceedings of SPIE - The International Society for Optical Engineering (Vol. 3149, pp. 222-231) https://doi.org/10.1117/12.292721