Development of a low loss, high dielectric strength microwave substrate

D. Sanders, S. Sampayan, George J Caporaso, M. Rhodes, J. Watson, K. Slenes, J. Jacquina, R. De La Fuenta, L. Thurmond

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Abstract

This work describes a comparison of two candidate materials for pulse forming line fabrication with respect to bulk dielectric breakdown, frequency response of relative permittivity, and dielectric loss. One material is a commercially available microwave substrate material that can be procured in sheet form without a high voltage specification, while the other is a newly developed material that also comes in sheet form that can also be cast between the electrodes.

Original languageEnglish (US)
Title of host publicationConference Record of the International Power Modulator Symposium and High Voltage Workshop
Pages291-294
Number of pages4
DOIs
StatePublished - 2006
Externally publishedYes
Event2006 IEEE International Power Modulator Conference, IPMC(27th Power Modulator Symposium and 2006 High Voltage Workshop) - Washington, DC, United States
Duration: May 14 2006May 18 2006

Other

Other2006 IEEE International Power Modulator Conference, IPMC(27th Power Modulator Symposium and 2006 High Voltage Workshop)
CountryUnited States
CityWashington, DC
Period5/14/065/18/06

ASJC Scopus subject areas

  • Engineering(all)

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    Sanders, D., Sampayan, S., Caporaso, G. J., Rhodes, M., Watson, J., Slenes, K., Jacquina, J., De La Fuenta, R., & Thurmond, L. (2006). Development of a low loss, high dielectric strength microwave substrate. In Conference Record of the International Power Modulator Symposium and High Voltage Workshop (pp. 291-294). [4216192] https://doi.org/10.1109/MODSYM.2006.365240