Design, double sided post-processing, and packaging of CMOS compatible Bio-MEMS device arrays

Jennifer M. Blain Christen, Cristina E Davis, Min Li, Andreas G. Andreou

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Scopus citations

Abstract

Methods for design, double-sided post-processing and packaging of commercially fabricated CMOS chips for Bio-MEMS applications are presented. These techniques apply to a wide range of devices and allow for both electrical and optical stimulation and assessment of biological specimens. The techniques are straightforward and can be applied to dies fabricated through state of the art CMOS foundries. The resulting assemblies are designed to withstand environments commonly necessary for working with the biological materials such as biological temperatures, pressures, and moisture or autoclave. The proposed packaging is extremely versatile and can be modified to accommodate numerous additions to the system such as syringe inlets or mountable elements.

Original languageEnglish (US)
Title of host publicationProceedings - IEEE International Symposium on Circuits and Systems
Volume1
Publication statusPublished - 2002
Externally publishedYes
Event2002 IEEE International Symposium on Circuits and Systems - Phoenix, AZ, United States
Duration: May 26 2002May 29 2002

Other

Other2002 IEEE International Symposium on Circuits and Systems
CountryUnited States
CityPhoenix, AZ
Period5/26/025/29/02

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ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

Cite this

Blain Christen, J. M., Davis, C. E., Li, M., & Andreou, A. G. (2002). Design, double sided post-processing, and packaging of CMOS compatible Bio-MEMS device arrays. In Proceedings - IEEE International Symposium on Circuits and Systems (Vol. 1)