Bubble formation on superhydrophobic micropatterns

Xinwei Wang, Siwei Zhao, Hao Wang, Tingrui Pan

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this paper, boiling phenomena on a copper surface coated with superhydrophobic micropatterns have been investigated. The micropatterns consisted of chemically inert nanoparticles (PTFE) were in square patterns 180 νm on each side with contact angles above 150° for the superhydrophobic behavior. Boiling experiments were conducted on the patterned copper surface with or without degassing treatment prior to heating, from which bubbles were found to form only on the superhydrophobic sites. As controlled experiments, a uniformly-coated superhydrophobic surface as well as a bare copper surface was also tested in comparison.

Original languageEnglish (US)
Title of host publicationASME 2011 International Mechanical Engineering Congress and Exposition, IMECE 2011
Pages607-611
Number of pages5
Volume10
EditionPARTS A AND B
StatePublished - Dec 1 2011
EventASME 2011 International Mechanical Engineering Congress and Exposition, IMECE 2011 - Denver, CO, United States
Duration: Nov 11 2011Nov 17 2011

Other

OtherASME 2011 International Mechanical Engineering Congress and Exposition, IMECE 2011
CountryUnited States
CityDenver, CO
Period11/11/1111/17/11

ASJC Scopus subject areas

  • Mechanical Engineering

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