Bubble formation on superhydrophobic-micropatterned copper surfaces

Xinwei Wang, Siwei Zhao, Hao Wang, Tingrui Pan

Research output: Contribution to journalArticle

29 Citations (Scopus)

Abstract

Surface physicochemical properties, including wettability and micro-nanoscopic roughness, play an important role in boiling heat transfer and interfacial phenomena. In the paper, we report investigation on bubble formation over superhydrophobic-micropatterned copper surfaces. The distinctive non-wetting micropatterns (of 180 × 180 μm2 squares) were fabricated by our recently reported stereomask lithography process, using a novel superhydrophobic nanocomposite formulation. The superhydrophobic nanocomposite, comprised of polytetrafluoroethylene (PTFE) nanoparticles (of 250 nm in diameter) in a polymeric matrix, presented high degree of hydrophobicity (with water contact angle > 150°). Standard boiling processes were studied with or without a prior-degassing procedure, experimentally. In addition, experiments on uniform superhydrophobic coating as well as bare copper surfaces were conducted as control. The experimental investigations revealed that the micropattern-coated copper surfaces had low bubble formation temperatures, similar to the uniformly coated superhydrophobic surfaces; and those emerging bubbles were more spherical and less likely to merge into a vapor layer.

Original languageEnglish (US)
Pages (from-to)112-119
Number of pages8
JournalApplied Thermal Engineering
Volume35
Issue number1
DOIs
StatePublished - Mar 1 2012

Fingerprint

Bubble formation
Copper
Boiling liquids
Nanocomposites
Degassing
Hydrophobicity
Polytetrafluoroethylenes
Lithography
Contact angle
Surface properties
Wetting
Surface roughness
Vapors
Nanoparticles
Heat transfer
Coatings
Water
Experiments
Temperature

Keywords

  • Boiling heat transfer
  • Bubble formation
  • Micropatterning
  • Nucleation
  • Superhydrophobicity

ASJC Scopus subject areas

  • Energy Engineering and Power Technology
  • Industrial and Manufacturing Engineering

Cite this

Bubble formation on superhydrophobic-micropatterned copper surfaces. / Wang, Xinwei; Zhao, Siwei; Wang, Hao; Pan, Tingrui.

In: Applied Thermal Engineering, Vol. 35, No. 1, 01.03.2012, p. 112-119.

Research output: Contribution to journalArticle

Wang, Xinwei ; Zhao, Siwei ; Wang, Hao ; Pan, Tingrui. / Bubble formation on superhydrophobic-micropatterned copper surfaces. In: Applied Thermal Engineering. 2012 ; Vol. 35, No. 1. pp. 112-119.
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