Abstract
This paper illustrates the effect of thermal treatment and alloy composition on the microstructures of gold-silver films and subsequently dealloyed nanoporous gold films. Even though thermal treatment of alloys increases tensile stress in gold-silver films, it mitigates the formation of microscale voids during dealloying. The voids in the dealloyed film are too large to be rationalized by relaxation of the residual stress. The interplay between volume shrinkage during dealloying, residual stress and thermally induced deformation is discussed to explain void formation.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 435-438 |
| Number of pages | 4 |
| Journal | Scripta Materialia |
| Volume | 60 |
| Issue number | 6 |
| DOIs | |
| State | Published - Mar 1 2009 |
| Externally published | Yes |
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Keywords
- Annealing
- Dealloying
- Fracture
- Porous material
- Residual stresses
ASJC Scopus subject areas
- Materials Science(all)
- Condensed Matter Physics
Cite this
A thermal treatment approach to reduce microscale void formation in blanket nanoporous gold films. / Seker, Erkin; Reed, Michael L.; Begley, Matthew R.
In: Scripta Materialia, Vol. 60, No. 6, 01.03.2009, p. 435-438.Research output: Contribution to journal › Article
}
TY - JOUR
T1 - A thermal treatment approach to reduce microscale void formation in blanket nanoporous gold films
AU - Seker, Erkin
AU - Reed, Michael L.
AU - Begley, Matthew R.
PY - 2009/3/1
Y1 - 2009/3/1
N2 - This paper illustrates the effect of thermal treatment and alloy composition on the microstructures of gold-silver films and subsequently dealloyed nanoporous gold films. Even though thermal treatment of alloys increases tensile stress in gold-silver films, it mitigates the formation of microscale voids during dealloying. The voids in the dealloyed film are too large to be rationalized by relaxation of the residual stress. The interplay between volume shrinkage during dealloying, residual stress and thermally induced deformation is discussed to explain void formation.
AB - This paper illustrates the effect of thermal treatment and alloy composition on the microstructures of gold-silver films and subsequently dealloyed nanoporous gold films. Even though thermal treatment of alloys increases tensile stress in gold-silver films, it mitigates the formation of microscale voids during dealloying. The voids in the dealloyed film are too large to be rationalized by relaxation of the residual stress. The interplay between volume shrinkage during dealloying, residual stress and thermally induced deformation is discussed to explain void formation.
KW - Annealing
KW - Dealloying
KW - Fracture
KW - Porous material
KW - Residual stresses
UR - http://www.scopus.com/inward/record.url?scp=58149527813&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=58149527813&partnerID=8YFLogxK
U2 - 10.1016/j.scriptamat.2008.11.027
DO - 10.1016/j.scriptamat.2008.11.027
M3 - Article
AN - SCOPUS:58149527813
VL - 60
SP - 435
EP - 438
JO - Scripta Materialia
JF - Scripta Materialia
SN - 1359-6462
IS - 6
ER -