A thermal treatment approach to reduce microscale void formation in blanket nanoporous gold films

Erkin Seker; Michael L. Reed; Matthew R. Begley

doi:10.1016/j.scriptamat.2008.11.027

A thermal treatment approach to reduce microscale void formation in blanket nanoporous gold films

Erkin Seker, Michael L. Reed, Matthew R. Begley

Research output: Contribution to journal › Article › peer-review

26 Scopus citations

Abstract

This paper illustrates the effect of thermal treatment and alloy composition on the microstructures of gold-silver films and subsequently dealloyed nanoporous gold films. Even though thermal treatment of alloys increases tensile stress in gold-silver films, it mitigates the formation of microscale voids during dealloying. The voids in the dealloyed film are too large to be rationalized by relaxation of the residual stress. The interplay between volume shrinkage during dealloying, residual stress and thermally induced deformation is discussed to explain void formation.

Original language	English (US)
Pages (from-to)	435-438
Number of pages	4
Journal	Scripta Materialia
Volume	60
Issue number	6
DOIs	https://doi.org/10.1016/j.scriptamat.2008.11.027
State	Published - Mar 1 2009
Externally published	Yes

Keywords

Annealing
Dealloying
Fracture
Porous material
Residual stresses

ASJC Scopus subject areas

Materials Science(all)
Condensed Matter Physics

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abstract = "This paper illustrates the effect of thermal treatment and alloy composition on the microstructures of gold-silver films and subsequently dealloyed nanoporous gold films. Even though thermal treatment of alloys increases tensile stress in gold-silver films, it mitigates the formation of microscale voids during dealloying. The voids in the dealloyed film are too large to be rationalized by relaxation of the residual stress. The interplay between volume shrinkage during dealloying, residual stress and thermally induced deformation is discussed to explain void formation.",

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AU - Reed, Michael L.

AU - Begley, Matthew R.

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N2 - This paper illustrates the effect of thermal treatment and alloy composition on the microstructures of gold-silver films and subsequently dealloyed nanoporous gold films. Even though thermal treatment of alloys increases tensile stress in gold-silver films, it mitigates the formation of microscale voids during dealloying. The voids in the dealloyed film are too large to be rationalized by relaxation of the residual stress. The interplay between volume shrinkage during dealloying, residual stress and thermally induced deformation is discussed to explain void formation.

AB - This paper illustrates the effect of thermal treatment and alloy composition on the microstructures of gold-silver films and subsequently dealloyed nanoporous gold films. Even though thermal treatment of alloys increases tensile stress in gold-silver films, it mitigates the formation of microscale voids during dealloying. The voids in the dealloyed film are too large to be rationalized by relaxation of the residual stress. The interplay between volume shrinkage during dealloying, residual stress and thermally induced deformation is discussed to explain void formation.

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KW - Fracture

KW - Porous material

KW - Residual stresses

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