A thermal treatment approach to reduce microscale void formation in blanket nanoporous gold films

Erkin Seker; Michael L. Reed; Matthew R. Begley

doi:10.1016/j.scriptamat.2008.11.027

A thermal treatment approach to reduce microscale void formation in blanket nanoporous gold films

Erkin Seker, Michael L. Reed, Matthew R. Begley

Research output: Contribution to journal › Article › peer-review

27 Scopus citations

Abstract

This paper illustrates the effect of thermal treatment and alloy composition on the microstructures of gold-silver films and subsequently dealloyed nanoporous gold films. Even though thermal treatment of alloys increases tensile stress in gold-silver films, it mitigates the formation of microscale voids during dealloying. The voids in the dealloyed film are too large to be rationalized by relaxation of the residual stress. The interplay between volume shrinkage during dealloying, residual stress and thermally induced deformation is discussed to explain void formation.

Original language	English (US)
Pages (from-to)	435-438
Number of pages	4
Journal	Scripta Materialia
Volume	60
Issue number	6
DOIs	https://doi.org/10.1016/j.scriptamat.2008.11.027
State	Published - Mar 1 2009
Externally published	Yes

Keywords

Annealing
Dealloying
Fracture
Porous material
Residual stresses

ASJC Scopus subject areas

Materials Science(all)
Condensed Matter Physics

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10.1016/j.scriptamat.2008.11.027

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@article{c9ab4cd822bb4e26b326dc0b8529d95d,

title = "A thermal treatment approach to reduce microscale void formation in blanket nanoporous gold films",

abstract = "This paper illustrates the effect of thermal treatment and alloy composition on the microstructures of gold-silver films and subsequently dealloyed nanoporous gold films. Even though thermal treatment of alloys increases tensile stress in gold-silver films, it mitigates the formation of microscale voids during dealloying. The voids in the dealloyed film are too large to be rationalized by relaxation of the residual stress. The interplay between volume shrinkage during dealloying, residual stress and thermally induced deformation is discussed to explain void formation.",

keywords = "Annealing, Dealloying, Fracture, Porous material, Residual stresses",

author = "Erkin Seker and Reed, {Michael L.} and Begley, {Matthew R.}",

year = "2009",

month = mar,

day = "1",

doi = "10.1016/j.scriptamat.2008.11.027",

language = "English (US)",

volume = "60",

pages = "435--438",

journal = "Scripta Materialia",

issn = "1359-6462",

publisher = "Elsevier Limited",

number = "6",

}

TY - JOUR

T1 - A thermal treatment approach to reduce microscale void formation in blanket nanoporous gold films

AU - Seker, Erkin

AU - Reed, Michael L.

AU - Begley, Matthew R.

PY - 2009/3/1

Y1 - 2009/3/1

N2 - This paper illustrates the effect of thermal treatment and alloy composition on the microstructures of gold-silver films and subsequently dealloyed nanoporous gold films. Even though thermal treatment of alloys increases tensile stress in gold-silver films, it mitigates the formation of microscale voids during dealloying. The voids in the dealloyed film are too large to be rationalized by relaxation of the residual stress. The interplay between volume shrinkage during dealloying, residual stress and thermally induced deformation is discussed to explain void formation.

AB - This paper illustrates the effect of thermal treatment and alloy composition on the microstructures of gold-silver films and subsequently dealloyed nanoporous gold films. Even though thermal treatment of alloys increases tensile stress in gold-silver films, it mitigates the formation of microscale voids during dealloying. The voids in the dealloyed film are too large to be rationalized by relaxation of the residual stress. The interplay between volume shrinkage during dealloying, residual stress and thermally induced deformation is discussed to explain void formation.

KW - Annealing

KW - Dealloying

KW - Fracture

KW - Porous material

KW - Residual stresses

UR - http://www.scopus.com/inward/record.url?scp=58149527813&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=58149527813&partnerID=8YFLogxK

U2 - 10.1016/j.scriptamat.2008.11.027

DO - 10.1016/j.scriptamat.2008.11.027

M3 - Article

AN - SCOPUS:58149527813

VL - 60

SP - 435

EP - 438

JO - Scripta Materialia

JF - Scripta Materialia

SN - 1359-6462

IS - 6

ER -

A thermal treatment approach to reduce microscale void formation in blanket nanoporous gold films

Abstract

Keywords

ASJC Scopus subject areas

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