A thermal treatment approach to reduce microscale void formation in blanket nanoporous gold films

Erkin Seker, Michael L. Reed, Matthew R. Begley

Research output: Contribution to journalArticle

22 Citations (Scopus)

Abstract

This paper illustrates the effect of thermal treatment and alloy composition on the microstructures of gold-silver films and subsequently dealloyed nanoporous gold films. Even though thermal treatment of alloys increases tensile stress in gold-silver films, it mitigates the formation of microscale voids during dealloying. The voids in the dealloyed film are too large to be rationalized by relaxation of the residual stress. The interplay between volume shrinkage during dealloying, residual stress and thermally induced deformation is discussed to explain void formation.

Original languageEnglish (US)
Pages (from-to)435-438
Number of pages4
JournalScripta Materialia
Volume60
Issue number6
DOIs
StatePublished - Mar 1 2009
Externally publishedYes

Fingerprint

blankets
Gold
microbalances
voids
Heat treatment
gold
Silver
residual stress
Residual stresses
silver
tensile stress
shrinkage
Tensile stress
microstructure
Microstructure
Chemical analysis

Keywords

  • Annealing
  • Dealloying
  • Fracture
  • Porous material
  • Residual stresses

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics

Cite this

A thermal treatment approach to reduce microscale void formation in blanket nanoporous gold films. / Seker, Erkin; Reed, Michael L.; Begley, Matthew R.

In: Scripta Materialia, Vol. 60, No. 6, 01.03.2009, p. 435-438.

Research output: Contribution to journalArticle

Seker, Erkin ; Reed, Michael L. ; Begley, Matthew R. / A thermal treatment approach to reduce microscale void formation in blanket nanoporous gold films. In: Scripta Materialia. 2009 ; Vol. 60, No. 6. pp. 435-438.
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