Abstract
In this paper, we present a remotely adjustable check-valve array with an electrochemical release mechanism for implantable biomedical microsystems. A SU-8 polymer layer deposited on the top of a gold sacrificial layer was used as the valve structural material. A constant DC current obtained via a telemetry link was used to electrochemically dissolve the gold sacrificial layer and activate the valves. 3×3 and 4×4 arrays each containing three different size valves (50×50, 100×100 and 200×200 μm2) were fabricated and tested. A current density of 35 mA/cm2 resulted in the dissolution of a 3000Å gold sacrificial layer in 30 seconds with the final release completed in 1-2 minutes.
| Original language | English (US) |
|---|---|
| Title of host publication | TRANSDUCERS 2003 - 12th International Conference on Solid-State Sensors, Actuators and Microsystems, Digest of Technical Papers |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| Pages | 115-118 |
| Number of pages | 4 |
| Volume | 1 |
| ISBN (Electronic) | 0780377311, 9780780377318 |
| DOIs | |
| State | Published - Jan 1 2003 |
| Externally published | Yes |
| Event | 12th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2003 - Digest of Technical Papers - Boston, United States Duration: Jun 8 2003 → Jun 12 2003 |
Other
| Other | 12th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2003 - Digest of Technical Papers |
|---|---|
| Country | United States |
| City | Boston |
| Period | 6/8/03 → 6/12/03 |
Fingerprint
Keywords
- Biological materials
- Biomedical materials
- Biomembranes
- Fabrication
- Gold
- Microvalves
- Polymers
- Telemetry
- Thermal conductivity
- Valves
ASJC Scopus subject areas
- Electrical and Electronic Engineering
Cite this
A remotely adjustable check-valve array with an electrochemical release mechanism for implantable biomedical microsystems. / Pan, Tingrui; Zheng, Wei; Lei, Ming; Cavanagh, B.; Ziaie, B.
TRANSDUCERS 2003 - 12th International Conference on Solid-State Sensors, Actuators and Microsystems, Digest of Technical Papers. Vol. 1 Institute of Electrical and Electronics Engineers Inc., 2003. p. 115-118 1215266.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
}
TY - GEN
T1 - A remotely adjustable check-valve array with an electrochemical release mechanism for implantable biomedical microsystems
AU - Pan, Tingrui
AU - Zheng, Wei
AU - Lei, Ming
AU - Cavanagh, B.
AU - Ziaie, B.
PY - 2003/1/1
Y1 - 2003/1/1
N2 - In this paper, we present a remotely adjustable check-valve array with an electrochemical release mechanism for implantable biomedical microsystems. A SU-8 polymer layer deposited on the top of a gold sacrificial layer was used as the valve structural material. A constant DC current obtained via a telemetry link was used to electrochemically dissolve the gold sacrificial layer and activate the valves. 3×3 and 4×4 arrays each containing three different size valves (50×50, 100×100 and 200×200 μm2) were fabricated and tested. A current density of 35 mA/cm2 resulted in the dissolution of a 3000Å gold sacrificial layer in 30 seconds with the final release completed in 1-2 minutes.
AB - In this paper, we present a remotely adjustable check-valve array with an electrochemical release mechanism for implantable biomedical microsystems. A SU-8 polymer layer deposited on the top of a gold sacrificial layer was used as the valve structural material. A constant DC current obtained via a telemetry link was used to electrochemically dissolve the gold sacrificial layer and activate the valves. 3×3 and 4×4 arrays each containing three different size valves (50×50, 100×100 and 200×200 μm2) were fabricated and tested. A current density of 35 mA/cm2 resulted in the dissolution of a 3000Å gold sacrificial layer in 30 seconds with the final release completed in 1-2 minutes.
KW - Biological materials
KW - Biomedical materials
KW - Biomembranes
KW - Fabrication
KW - Gold
KW - Microvalves
KW - Polymers
KW - Telemetry
KW - Thermal conductivity
KW - Valves
UR - http://www.scopus.com/inward/record.url?scp=84944752254&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84944752254&partnerID=8YFLogxK
U2 - 10.1109/SENSOR.2003.1215266
DO - 10.1109/SENSOR.2003.1215266
M3 - Conference contribution
VL - 1
SP - 115
EP - 118
BT - TRANSDUCERS 2003 - 12th International Conference on Solid-State Sensors, Actuators and Microsystems, Digest of Technical Papers
PB - Institute of Electrical and Electronics Engineers Inc.
ER -